Suitable for use in membrane switches and steel dome contact applications. Go to product viewer dialog for this item. IPC-4556 - Amendment 1
A major advantage of following IPC-4556 is that it ensures the surface is compatible with diverse attachment technologies: ipc4556 pdf
IPC-4556 specifies X-ray Fluorescence (XRF) as the primary method for verifying thickness. It mandates the use of Solid State Detectors (SSD) for better resolution on tri-level coatings and requires calibration against national standards. Suitable for use in membrane switches and steel
This critical update added a maximum gold thickness of 0.070 µm. This limit prevents "hyper-corrosion" of the nickel, which can occur if the gold plating process is too aggressive or prolonged. It mandates the use of Solid State Detectors
ENEPIG was developed largely to solve the "black pad" corrosion issues sometimes found in ENIG (Electroless Nickel / Immersion Gold) finishes. The palladium layer acts as a buffer, preventing the immersion gold reaction from attacking the underlying nickel.
High pull strengths for gold, aluminum, and even copper wire bonding.